NITRILE PHENOLIC
Arlon Innovations Phenolic based adhesive system is ideally applied to many substrates including Aramid paper, Polyimide film, PET film and aluminum foil. The adhesive is applied to the substrate in B-stage form. Once B-staged, the adhesive and substrate can be heated and pressed for full cure bonding to steel, copper, and many other substrates. The Phenolic based adhesive provides a superior thermal stability with high electrical properties, and strong chemical resistance. It has an extremely high continuous use temperature and is tack free at room temperature, not requiring a release liner. It is also RoHS and REACH compliant.
Unique Features
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Excellent thermal stability, electrical properties, and chemical resistance
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Extremely high adhesive bond strength
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High continuous temperature resistance
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RoHS and REACH compliant
